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描述
103670-8 is a right-angle, through-hole (THT) header connector from the AMPMODU MTE interconnect system designed for wire-to-board applications. It features matte tin plating and is compatible with receptacle assemblies using either Insulation Displacement Contacts (IDC) or crimp snap-in contacts. The connector supports 2–25 positions per row with a 100 mil centerline spacing and operates reliably across a temperature range of -65°C to +105°C. It accommodates wire gauges from #20 to #32 AWG depending on the contact type, with a maximum current rating of 3 amps per single contact in free air. This connector is widely used in medical instruments, automotive controls, computers, appliances, and telecommunications equipment where reliable wire-to-board connections are required.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 9
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 1036708
规格
常见问题
103670-8 是否符合 RoHS 标准？
不，103670-8 不符合 RoHS 标准。
103670-8 的交货期是多少？
103670-8 的标准交货期约为 17 天。有库存的数量由 Master Electronics 发货。
有存货: 908
可立即发货
库存数量的起订量: 42
缺货数量的起订量: 756
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 21
工厂交货期 17 周
3D PDF
数据表
Product Specification - AMPMODU MTE Interconnection System
Instruction Sheet - AMPMODU MTE CONNECTORS
