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描述
The 103670-4 is an MTE Crimp Pin Housing designed for the AMPMODU MTE interconnect system, which serves wire-to-board and wire-to-wire applications across industrial equipment including computers, medical instruments, automotive controls, and telecommunications systems. This housing accommodates 5-position crimp snap-in pin contacts and supports the flexible AWG range of #20–#32 for crimp configurations. The product is available with three plating options (15 µ" Au, 30 µ" Au, and Matte Tin) and operates reliably over a temperature range of -65°C to +105°C. The housing features latching and polarization capabilities, with swage options on posts providing retention in printed circuit boards. This component is ideal for applications requiring cost-effective, medium-volume assembly with flexibility in wire gauge selection.
产品亮点:
- Header
- Wire Termination Type = Crimp, Insulation Displacement Crimp (IDC)
- Number of Positions = 5
- Number of Rows = Single
- Post Size = 0.64 [.025] mm [in]
搜索关键词: 1036704
规格
常见问题
103670-4 是否符合 RoHS 标准？
不，103670-4 不符合 RoHS 标准。
103670-4 的交货期是多少？
103670-4 的标准交货期约为 17 周。有库存的数量由 Master Electronics 发货。
有存货: 4,378
发货 today, 输入设置值。
最小订购数量: 210
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 35
工厂交货期 17 周
3D PDF
Product Drawing - HDR ASSY, VERT, SINGLE ROW 2.54[.100] CL, 0.64[.025] SQ POST, WITH PLZN
数据表
Product Specification - Connector, AMPMODU, MTE
Instruction Sheet - AMPMODU MTE CONNECTORS
