描述
The 103639-8 is a vertical through-hole IDC (Insulation Displacement Contact) header connector from the TE Connectivity AMPMODU MTE interconnect system, featuring matte tin plating for standard applications. This connector supports 2–25 position configurations with a 100 mil centerline spacing and accommodates wire gauges in the #22–#30 AWG range for IDC configurations. The product is designed for wire-to-board applications and operates reliably across a temperature range of -65°C to +105°C, with a current rating of 3 amps per contact in free air and 267 V operating voltage. The connector implements latching and polarization features through coupling shrouds and guide ribs, making it suitable for use in computers, copiers, commercial printers, appliances, medical equipment, and automotive controls where reliable interconnection is essential.
搜索关键词: 1036398
规格
常见问题
103639-8 是否符合 RoHS 标准?
不,103639-8 不符合 RoHS 标准。
103639-8 的交货期是多少?
103639-8 的标准交货期约为 15 天。有库存的数量由 Master Electronics 发货。
有存货: 550
可立即发货
库存数量的起订量: 42
缺货数量的起订量: 42
此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时,订单会获得已付款状态。: 21
工厂交货期 15 周
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