PIC24HJ128GP202-I/SP by microchip technology

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PIC24HJ128GP202-I/SP

Microcontroller - PIC 24H - 16-Bit - 40 MIPs - 21 I/O - 128KB (43K x 24) OTP Program Memory - 8K x 8 RAM - 3 to 3.6V - 28-SPDIP.

产品说明书

符合 RoHS 规定

TUBE 包装

This product may require extra documentation. Shipping may be delayed 1-2 days.

描述

The PIC24HJ128GP202-I/SP is microcontroller with operating temperature range from -40°C to 85°C.

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Search Keywords: PIC24HJ128GP202ISP

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Products found: 0

供应商:

Microchip Technology

部件编号:

PIC24HJ128GP202-I/SP

计量单位:

Per Each

RoHS:

Yes

HTS:

8542310020

COO:

ECCN:

3A991.a.2

供应商标准包装:

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

Package Type:

TUBE

有存货: 195

可立即发货

BONDED Quantity: 0

工厂库存: 13 可以发货 5/15/26

Stock lot only:

库存数量的起订量: 15

缺货数量的起订量: 30

Multiple: 15

工厂交货期 5 周可以发货 6/5/26

This product is no longer being manufactured but there may be alternatives. We can help you, 连系我们.

数量

Unit Price

$8.88

$8.86

$6.64

$6.20

120 +

$6.08

Suppliers Standard Package

Tools/3D Models

产品指南

产品说明书

Product Changes

PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB

PCN - 12-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 20-Oct-2010 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 12-Jan-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Nov-2009 - Microchip Has Released A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128

PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 03-Aug-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 03-Aug-2011 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision

PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 19-Apr-2012 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 13-Jan-2012 - Errata Silicon Die Revision Addition And Errata Document Revision

PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED

PCN - 19-Apr-2012 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS

PCN - 22-Mar-2011 - A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 25-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

Product Change Notification

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PIC24HJ128GP202-I/SP

描述

规格

Standard Packaging

Reel Packaging

Tools/3D Models

产品指南

Product Changes