PIC24HJ128GP202-I/SP by microchip technology

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Microchip Technology 授权经销商

PIC24HJ128GP202-I/SP

Name: PIC24HJ128GP202-I/SP Microchip Technology Microcontrollers
Brand: Microchip Technology
SKU: 44793936
Availability: InStock

Microcontroller - PIC 24H - 16-Bit - 40 MIPs - 21 I/O - 128KB (43K x 24) OTP Program Memory - 8K x 8 RAM - 3 to 3.6V - 28-SPDIP.

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符合 RoHS

TUBE 包装

此产品可能需要额外文件。发货可能会延迟 1-2 天。

描述

The PIC24HJ128GP202-I/SP is microcontroller with operating temperature range from -40°C to 85°C.

产品亮点:

潜在应用:

搜索关键词: PIC24HJ128GP202ISP

规格

产品属性

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找到的产品: 0

供应商:

Microchip Technology

部件编号:

PIC24HJ128GP202-I/SP

计量单位:

每 Each

RoHS:

Yes

HTS:

8542310020

COO:

ECCN:

3A991.a.2

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

封装类型:

TUBE

常见问题

PIC24HJ128GP202-I/SP 是否符合 RoHS 标准？

是的，PIC24HJ128GP202-I/SP 符合 RoHS 标准。

PIC24HJ128GP202-I/SP 的交货期是多少？

PIC24HJ128GP202-I/SP 的标准交货期约为 27 周。有库存的数量由 Master Electronics 发货。

有存货: 90

可立即发货

BONDED 数量: 0

制造商库存: 337 可以发货 10/5/26

仅库存批次:

库存数量的起订量: 15

缺货数量的起订量: 30

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 15

工厂交货期 27 周可以发货 4/5/27

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

$8.88

$8.86

$6.64

$6.20

120 +

$6.08

供应商标准包装

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工具/3D模型

产品指南

数据表

产品更改

PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB

PCN - 12-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 20-Oct-2010 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 12-Jan-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Nov-2009 - Microchip Has Released A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128

PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 03-Aug-2011 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 03-Aug-2011 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision

PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 19-Apr-2012 - Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic24Hj128Gpx02/X04 Data Sheet Document Revision

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 13-Jan-2012 - Errata Silicon Die Revision Addition And Errata Document Revision

PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED

PCN - 19-Apr-2012 - Microchip Has Released A New Devicedoc For The Listed Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04 And Pic

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS

PCN - 22-Mar-2011 - A New Devicedoc For The Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 25-Jan-2010 - Errata-Pic24Hj32Gp302/304, Pic24Hj64Gpx02/X04, Pic24Hj128Gpx02/X04 Family Errata

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PIC24HJ128GP202-I/SP

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