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Integrated Circuits - ICs
Linear
Amplifiers - Op Amps, Buffer, Instrumentation
MCP6042T-I/SN

替代产品

Alternative Packaging

MCP6042-I/SN

有存货: 2,550
起订量: 100

MCP6042T-I/SN by microchip technology

Image is representational - see mfr. specs

MCP6042T-I/SN

Microchip Technology

Dual Op Amp - 14kHz GBP - 600nA - Rail to Rail I/O - 1.4 to 6.0 VDC - -40°C to 85°C - 8-lead SOIC - Tape&Reel ...

产品说明书

符合 RoHS 规定

REEL 包装

附件

Request Programming Quote

Certificate of Compliance Guarantee

描述

The MCP6042T-I/MS is a dual rail-to rail input and output operational amplifier with a single supply voltage as low as 1.4V, while drawing less than 1 µA (maximum) of quiescent current per amplifier. It works in industrial temp. range -40°C-85°C. Package type is a Plastic SOIC (150 mil Body), 8-lead.

Product Highlights:

Potential Applications:

Search Keywords: MCP6042TISN

规格

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供应商:

Microchip Technology

部件编号:

MCP6042T-I/SN

计量单位:

Per Each

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

3300

Package Type:

REEL

Maximum Dual Supply Voltage:

N/R

Family:

MCP6042

Maximum Input Bias Current:

N/A

Maximum Input Offset Voltage:

3@5.5V mV

Dimension:

4.9 x 3.9 x 1.25(Min) mm

Maximum Input Offset Current:

0.000001(Typ)@5.5V uA

Maximum Operating Supply Voltage:

6 V

Manufacturer Type:

General Purpose Amplifier

This product is not in stock and cannot be back-ordered

This product is discontinued, but still in stock

This product is not in stock and cannot be back-ordered

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

This product is NOT RoHS Compliant. See Alternatives

End of Life: Final orders must be placed by

有存货: 7,025

Ships today, if you order in

BONDED Quantity: 0

工厂库存: 714,418 可以发货 6/29/26

Stock lot only:

Minimum Order Quantity: 500

缺货数量的起订量:

Multiple: 1

工厂交货期 4 周可以发货 7/15/26

This product is no longer being manufactured but there may be alternatives. We can help you, 连系我们.

Your order may include a combination of full reels and cut tape depending on available stock.

Need guaranteed full reels? Contact Sales

PRICE (USD)

A tariff of {0} may be applied if shipping to the United States.

数量

Unit Price

500

$0.844

1,000

$0.836

3,300

$0.761

6,600

$0.759

9,900

$0.757

13,200

$0.755

16,500

$0.753

26,400 +

$0.752

Reel Package

Standard Packaging

Standard packaging is the minimum package size Masterelectronics.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

Log in for special pricing Click for Quote Price Match Request

Schedule Order

You may schedule release quantities and ship dates in the shopping cart.

Tools/3D Models

产品指南

产品说明书

Product Changes

PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS

PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 22-Jan-2004 - Product Change Notice

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 20-May-2010 - QUALIFICATION OF LARGER PADDLE IN 8L MSOP PACKAGE WITH G600F MOLD COMPOUND AT MMS (ATES) ASSEMBLY

PCN - 11-Nov-2004 - Product Change Notice

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 26-May-2005 - Product Change Notice

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 04-Mar-2013 - Microchip Has Released A New Devicedoc For The Mcp6041/2/3/4 Datasheet Of Devices In Order To Improv

PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 30-Jan-2006 - Product Change Notice

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.

PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 04-Mar-2013 - Data Sheet - Mcp6041/2/3/4 Datasheet Data Sheet Document Revision

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 08-Mar-2007 - Product Change Notice

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 8L SOIC PACKAGE WITH PALLADIUM COATED COPPER

Product Change Notification

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