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24LC02B-I/SN

有存货: 3,000
起订量: 100

24LC02BT-I/SN by microchip technology

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Microchip Technology 授权经销商

24LC02BT-I/SN

EEPROM - Serial I²C - 2Kb (256 x 8) - 2.5V/3.3V/5V - 8-Pin SOIC - Tape&Reel ...

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符合 RoHS

REEL 包装

描述

The Microchip Technology Inc. 24AA02/24LC02B is a 2Kb I2C™ compatible Serial EEPROM. The device is organized as one block of 256 x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.7V, with standby and active currents of only 1 µA and 1 mA, respectively. The 24XX02 also has a page write capability for up to 8 bytes of data. The 24XX02 is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3 DFN and MSOP packages and is also available in the 5-lead SOT-23 package.

产品亮点:

潜在应用:

搜索关键词: 24LC02BTISN

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

24LC02BT-I/SN

计量单位:

每 Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

卷盘包装:

此信息适用于希望按制造商标准包装数量的倍数购买的客户。最低订购数量和要求的订购倍数会与价格和库存信息一同显示。

3300

封装类型:

REEL

数据保持:

200(Min) Year

常见问题

24LC02BT-I/SN 是否符合 RoHS 标准？

是的，24LC02BT-I/SN 符合 RoHS 标准。

24LC02BT-I/SN 的交货期是多少？

24LC02BT-I/SN 的标准交货期约为 4 周。有库存的数量由 Master Electronics 发货。

提供不同的包装选项。查看替代品

有存货: 12,200

发货 today, 输入设置值。

BONDED 数量: 0

制造商库存: 370,310 可以发货 11/2/26

仅库存批次:

最小订购数量: 1000

缺货数量的起订量:

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 1

工厂交货期 4 周可以发货 11/18/26

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

1,000

$0.3230

3,300

$0.2824

6,600

$0.2810

9,900

$0.2803

13,200

$0.2796

16,500

$0.2789

26,400

$0.2782

52,800 +

$0.2775

卷盘包装

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产品指南

产品更改

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 07-Nov-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 06-Nov-2003 -

PCN - 08-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (PDCUAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 16-Sep-2008 - Microchip serial EEPROMs will be moved from their current 121K (0.7 micron) or 150K (0.5 micron) fab

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Nov-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 30-Jan-2006 -

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 08-Nov-2002 -

PCN - 23-Sep-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 20-Dec-2018 - FINAL NOTICE QUALIFICATION OF 36.3K PROCESS TECHNOLOGY FOR SELECTED MICROCHIP PRODUCTS

PCN - 28-Aug-2021 - DATA SHEET - 24AA02/24LC02B/24FC02 2K I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

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PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 19-Jul-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 08-Apr-2015 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (PDCUAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 09-May-2019 - DATA SHEET - 24AA02/24LC02B/24FC02 DATA SHEET CHANGE

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 16-Sep-2008 - CONVERSION OF 24LC01B, 24AA01, 24LC02B AND 24AA02 PRODUCT FAMILIES TO 160K

PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 28-Jun-2005 -

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 01-Dec-2002 -

PCN - 01-Oct-2007 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 5L SOT23 PACKAGED SERIAL EEPROM PRODUCTS

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

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PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 01-Oct-2007 - QUALIFICATION OF UTAC THAI LIMITED TO TEST 5L SOT23 PACKAGED SERIAL EEPROM PRODUCTS

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PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

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PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

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PCN - 08-Mar-2007 -

PCN - 01-Jun-2015 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (PDCUAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

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PCN - 11-Nov-2004 -

PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

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PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 22-Mar-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

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PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

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PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

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PCN - 01-Jan-2002 -

PCN - 26-Jan-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG

PCN - 01-Jun-2015 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (PDCUAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 13-Jul-2006 - QUALIFICATION OF 8L DFN 2X3MM AT AIC

PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

PCN - 16-Feb-2022 - MANUFACTURING CHANGE

PCN - 19-Jul-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

PCN - 19-Dec-2018 - DATA SHEET UPDATE FOR 24AA02/24LC02B/24FC02

PCN - 17-Mar-2021 - 24AA02/24LC02B/24FC02 2K I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 07-Apr-2022 - MANUFACTURING CHANGE

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.