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24FC256T-I/MS

有存货: 2,500
起订量: 625

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Microchip Technology 授权经销商

24FC256-I/MS

Name: 24FC256-I/MS Microchip Technology PROM EPROM EEPROM
Brand: Microchip Technology
SKU: 44794818
Availability: InStock

EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube

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询问数据表

符合 RoHS

TUBE 包装

描述

EEPROM - Serial-I²C - 256Kb (32K x 8) - 1MHz - 1.8V/2.5V/3.3V/5V - 8-Pin MSOP - Tube

产品亮点:

潜在应用:

搜索关键词: 24FC256IMS

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

24FC256-I/MS

计量单位:

每 Each

RoHS:

Yes

HTS:

8542320051

COO:

ECCN:

EAR99

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

100

封装类型:

TUBE

数据保持:

200(Min) Year

常见问题

24FC256-I/MS 是否符合 RoHS 标准？

是的，24FC256-I/MS 符合 RoHS 标准。

24FC256-I/MS 的交货期是多少？

24FC256-I/MS 的标准交货期约为 5 周。有库存的数量由 Master Electronics 发货。

提供不同的包装选项。查看替代品

有存货: 600

发货 today, 输入设置值。

BONDED 数量: 0

制造商库存: 1,700 可以发货 10/12/26

仅库存批次:

最小订购数量: 100

缺货数量的起订量:

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 100

工厂交货期 5 周可以发货 11/4/26

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

100

$0.746

300

$0.685

500

$0.683

1,000

$0.676

2,500

$0.633

5,000

$0.631

7,500

$0.617

10,000 +

$0.616

供应商标准包装

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工具/3D模型

产品指南

数据表

产品更改

PCN - 03-Apr-2013 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices in orde

PCN - 26-Jan-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG

PCN - 09-Jun-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 30-Jan-2006 -

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)

PCN - 06-Nov-2003 -

PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 26-Jun-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE

PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

PCN - 17-Apr-2019 - RE-ISSUED FINAL NOTIFICATION - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE

PCN - 03-Apr-2013 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET DOCUMENT REVISION

PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 14-May-2010 - Microchip has released a new DeviceDoc for the 24AA256/24LC256/24FC256 Data Sheet of devices.

PCN - 08-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K, 160K AND 250K WAFER TECHNOLOGIES

PCN - 26-Nov-2013 - 24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 03-Jun-2004 -

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER

PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to

PCN - 26-Nov-2013 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 25-Oct-2021 - DATA SHEET - 24AA256/24LC256/24FC256 256 KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

PCN - 20-Aug-2018 - UPDATED FIRST LINE MARKING CODES TABLE

PCN - 23-May-2018 - ISSUED FINAL NOTIFICATION QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 04-Sep-2015 - QUALIFICATION OF 220K (0.18 MICRON) PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 10-Dec-2012 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 27-May-2010 - CONVERSION OF 24LC256, 24FC256 AND 24AA256 PRODUCT FAMILIES TO 160K TECHNOLOGY

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 06-Mar-2006 -

PCN - 29-Jun-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L MSOP package products with SG-8300GM mold com

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 22-Jan-2004 -

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 28-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF THE 150K AND 160K WAFER

PCN - 07-Aug-2019 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET CHANGE

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 08-Nov-2010 - QUALIFICATION OF 8L MSOP PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 26-Feb-2009 - CHANGE SHIPPING MATERIALS FROM MOISTURE BARRIER BAG TO STATIC SHIELDED BAG

PCN - 27-May-2010 - 24LC256, 24FC256 and 24AA256 serial EEPROMs will be moved from their current 150K (0.5 micron) fabri

PCN - 23-Apr-2001 -

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 09-Jul-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 22-Dec-2017 - RE-ISSUED INITIAL NOTICE QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 05-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 10-Dec-2012 - 24AA256/24LC256/24FC256 DATA SHEET

PCN - 13-Jul-2011 - DATA SHEET-24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 22-Jan-2004 -

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 10-Dec-2012 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices.

PCN - 11-Nov-2004 -

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

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24FC256-I/MS

描述

规格

常见问题

价格 (USD)

标准包装

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工具/3D模型

产品指南

产品更改

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