替代产品

替代包装

PIC24FJ256GB106T-I/PT

PIC24FJ256GB106T-I/PT

有存货: 2,017
起订量: 50

PIC24FJ256GB106-I/PT by microchip technology

图片仅供参考 - 请查看制造商规格

Microchip Technology 授权经销商

PIC24FJ256GB106-I/PT

MCU 16-bit - PIC24 Family PIC24FJ GB Series Microcontrollers - 256KB Flash - 2.5V/3.3V - 64-Pin. ...

查看数据表询问数据表

符合 RoHS

TRAY 包装

此产品可能需要额外文件。发货可能会延迟 1-2 天。

描述

The PIC24FJ256GB106-I/PT is a 16bit, general purpose flash microcontroller in 64 pin TQFP package. The device has five 16bit timers, 16 channel 10bit A/D converter, three analogue comparators with programmable input/output configuration, hardware real time clock/calendar (RTCC) and charge time measurement unit (CTMU).

产品亮点:

潜在应用:

搜索关键词: PIC24FJ256GB106IPT

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

PIC24FJ256GB106-I/PT

计量单位:

每 Each

RoHS:

Yes

HTS:

8542310020

COO:

TH

ECCN:

3A991.a.2

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

160

封装类型:

TRAY

工作温度:

-40 to 85 °C

程序存储器类型:

Flash

可编程I/O数量:

52

ADC分辨率:

10 bit

程序存储器容量:

256 KB

RAM容量:

16 KB

提供不同的包装选项。查看替代品

有存货: 606

可立即发货

BONDED 数量: 0

制造商库存: 0

已订购: 1,440 可以发货 10/12/26

仅库存批次:

最小订购数量: 5

缺货数量的起订量:

多项: 1

工厂交货期 28 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

5

$7.58

25

$6.72

50

$6.34

160

$5.98

320

$5.95

640

$5.94

1,120

$5.92

2,560 +

$5.91

供应商标准包装

登录以获取特别价格

工具/3D模型

产品指南

Learn more about Microchip Technology Top Selling Microcontrollers and Microprocessors

产品更改

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, UFAD UGAA,UGAF MASKS WITHOUT POLYIMIDE PROCESS

PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 11-Oct-2013 - Microchip is announcing the qualification of masks UDAAx, UFACx, UGABx and YGAYx at an additional wa

PCN - 11-Oct-2013 - Microchip is announcing the qualification of MTAI assembly site with palladium coated copper (PdCu)

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED

PCN - 13-Jul-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA

PCN - 28-Nov-2011 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE

PCN - 10-Mar-2011 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX, YGAUX, YGASX, YGARX, AND YGAQX MASKS AT ADDITIONAL WAFER SITE

PCN - 14-Jul-2011 - ERRATA-PIC24FJ256GA110 FAMILY SILICON/DATA SHEET ERRATA

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 09-Feb-2022 - PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA DOCUMENT REVISION

PCN - 01-Jun-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 01-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 19-Feb-2010 - ERRATA - PIC24FJ256GB110 FAMILY REV. A3 SILICON ERRATA

PCN - 14-Jan-2011 - QUALIFICATION OF YGANX, YGAYX, YGAWX,YGAUX, YGASX, YGARX,YGAQX MASKS AT AN ADDITIONAL WAFER

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 22-Jan-2013 - ERRATA-PIC24FJ256GB110 FAMILY SILICON/DATA SHEET ERRATA

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 17-Dec-2009 - MICROCHIP HAS RELEASED A NEW DEVICEDOC

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 02-Jun-2011 - Microchip is announcing the qualification of 64L QFN (9x9) packages with EFTEC-64T leadframe at NSEB

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 03-Jan-2014 - QUALIFICATION OF MASKS UDAAX, UFACX, UGABX & YGAYX AT AN ADDITIONAL WAFER FABRICATION SITE

PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.

PCN - 11-Nov-2011 - QUALIFICATION OF YGAN/Z/H/Q/R/S/U/W/Y, UCAA, UFAC, AND UFAD MASKS WITHOUT POLYIMIDE PROCESS

PCN - 02-Aug-2012 - Microchip is announcing the qualification of YGANx, YGAYx, YGAWx, YGAUx, YGASx, YGARx, and YGAQx mas

PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 27-Apr-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 15-Sep-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE PIC24FJ256GB110

PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

Product Change Notification

客户还购买了

24 Position FPC Connector Contacts, Top and Bottom 0.020" (0.50mm) Surface Mount, Right An...

TERMINAL,PIDG SPD 16-14 8

SEMI HARD TRAY AND EMBOSS TAPE SUPPLY MINI PCI EXPRESS CONNECTOR ASSEMBLY

03P UMNL HDR ASSY R/A 94VO

MICRO-MATCH FTE,20P