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描述
MDM96519-559 is a microminiature connector from ITT Cannon's MDM series, designed for high-density interconnect applications in harsh environments. The connector features microsocket contacts with 0.050" (1.27 mm) contact spacing in a 0.100" x 0.100" (2.54 mm x 2.54 mm) grid pattern with 0.050" (1.27 mm) offset. It includes an interfacial seal and jackscrew/jackpost bushing hardware for secure mating. These connectors are commonly used in aerospace, defense, instrumentation, and medical applications where reliable, compact interconnect solutions are required.
搜索关键词: MDM96519559
规格
常见问题
MDM96519-559 是否符合 RoHS 标准？
是的，MDM96519-559 符合 RoHS 标准。
MDM96519-559 的交货期是多少？
MDM96519-559 的标准交货期约为 18 周。有库存的数量由 Master Electronics 发货。
有存货: 0
缺货数量的起订量: 3
工厂交货期 18 周
数据表
Learn more about ITT Cannon Micro-D / MDM Series