描述

The 50-4-100 is a Soder-Wick® desoldering braid designed for safe and efficient solder removal from electronic components and circuit boards. It features pure copper braid construction with optimized design for faster wicking and heat transfer, allowing operation at lower temperatures to minimize thermal damage to heat-sensitive components. The product uses Rosin Grade WW, Type "R" flux and is halide-free, requiring little or no post-solder cleaning while producing no corrosive residues. With a width of 0.110 inches (2.8 mm) and blue color identification, this size is suitable for general desoldering applications on thru-hole components, SMT pads, and BGA pads. The braid meets industry standards including ANSI/IPC J STD-004, MIL-F-14256 F, and NASA-STD-8739.3, with a shelf life of 2 years, making it ideal for professional electronics repair, rework, and manufacturing environments.