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532702B02500G by boyd laconia llc
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Boyd Laconia LLC 授权经销商

532702B02500G

The 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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符合 RoHS
包装
附件
请求编程报价
合规证书

描述

The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.

搜索关键词: 532702B02500G

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
Boyd Laconia LLC
部件编号:
532702B02500G
别名/又称:
041699
计量单位:
每 Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
1
器件冷却方式:
TO-2206707
安装方式:
N/A
尺寸:
41.91 x 25.4 x 50.86714mm
热阻:
4.86717°C/W
表面处理:
Black Anodized6710

常见问题

532702B02500G 是否符合 RoHS 标准？

是的，532702B02500G 符合 RoHS 标准。

532702B02500G 的交货期是多少？

532702B02500G 的标准交货期约为 9 周。有库存的数量由 Master Electronics 发货。

有存货: 2,920

发货 today, 输入设置值。

最小订购数量: 5

工厂交货期 9 周

价格 (USD)

数量
单价
5
$6.46
25
$5.93
100
$5.66
250
$5.37
500
$5.17
1,000
$4.98
3,000
$4.96
5,000 +
$4.93
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