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532702B02500G by boyd laconia llc
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532702B02500G

Boyd Laconia LLC

The 532702B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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符合 RoHS 规定
包装
附件
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描述

The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.

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供应商:
Boyd Laconia LLC
部件编号:
532702B02500G
Alias/AKA:
041699
计量单位:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Device Cooled:
TO-2206707
Attachment Method:
N/A
Dimension:
41.91 x 25.4 x 50.86714mm
Thermal Resistance:
4.86717°C/W
Finish:
Black Anodized6710

有存货: 2,920

可立即发货

Minimum Order Quantity: 5

工厂交货期 9 周

数量
Unit Price
5
$6.46
25
$5.93
100
$5.66
250
$5.37
500
$5.17
1,000
$4.98
3,000
$4.96
5,000 +
$4.93
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