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532602B02500G by boyd laconia llc
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532602B02500G

Boyd Laconia LLC

The 532602B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

产品说明书
符合 RoHS 规定
Bulk 包装
附件
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描述

The 532602B02500G is a dual radial board-level heat sink intended for cooling TO-220 and TO-220-single gauge semiconductor packages. Constructed from aluminum with a black anodize finish, it provides effective thermal management for high-power components. This heat sink is designed for vertical mounting and has dimensions of 41.91 mm in width, 25.40 mm in length, and 38.10 mm in height. It is suitable for board-level cooling applications where efficient heat dissipation is critical for system reliability and performance.

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规格

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Products found: 0
供应商:
Boyd Laconia LLC
部件编号:
532602B02500G
Alias/AKA:
041681
计量单位:
Per Each
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
41.91 x 25.4 x 38.1 mm
Thermal Resistance:
5.5 °C/W
Finish:
Black Anodized

有存货: 100

可立即发货

已订购: 2,040   可以发货 6/11/26 

Minimum Order Quantity: 5

工厂交货期 9 周

数量
Unit Price
5
$3.742
25
$2.950
50
$2.711
240
$2.429
480
$2.361
720
$2.355
1,200
$2.283
4,080 +
$2.277
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