531302B02500G
Heat Sink Passive TO-202/TO-220 Radial Thru-Hole Aluminum 8°C/W Black Anodized ...
描述
531302B02500G is an extruded aluminum board level heat sink from the Extruded 5310 series, designed to cool TO-202 and TO-220 semiconductor devices. This dual radial heat sink features a black anodize finish and requires a mounting kit for device attachment. The heat sink has dimensions of 34.92 mm width, 12.70 mm length, and 63.50 mm height ("H" dimension), with a vertical mounting direction. Additional mounting dimensions include "X" Dim of 12.70 mm, "Y" Dim of 0.79 mm, and "Z" Dim of 2.67 mm. This RoHS compliant heat sink is ideal for board level thermal management applications requiring efficient heat dissipation from power transistors and voltage regulators.
搜索关键词: 531302B02500G
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常见问题
531302B02500G 是否符合 RoHS 标准?
是的,531302B02500G 符合 RoHS 标准。
531302B02500G 的交货期是多少?
531302B02500G 的标准交货期约为 8 周。有库存的数量由 Master Electronics 发货。
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