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531302B02500G
Heat Sink Passive TO-202/TO-220 Radial Thru-Hole Aluminum 8°C/W Black Anodized ...
描述
531302B02500G is an extruded aluminum board level heat sink from the Extruded 5310 series, designed to cool TO-202 and TO-220 semiconductor devices. This dual radial heat sink features a black anodize finish and requires a mounting kit for device attachment. The heat sink has dimensions of 34.92 mm width, 12.70 mm length, and 63.50 mm height ("H" dimension), with a vertical mounting direction. Additional mounting dimensions include "X" Dim of 12.70 mm, "Y" Dim of 0.79 mm, and "Z" Dim of 2.67 mm. This RoHS compliant heat sink is ideal for board level thermal management applications requiring efficient heat dissipation from power transistors and voltage regulators.
搜索关键词: 531302B02500G
规格
FREQUENTLY ASKED QUESTIONS
Is 531302B02500G RoHS compliant?
Yes, 531302B02500G is RoHS compliant.
What is the lead time for 531302B02500G?
The standard lead time for 531302B02500G is approximately 8 days. In-stock quantities ship from Master Electronics.
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