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375424B00034G by boyd laconia llc
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Boyd Laconia LLC 授权经销商

375424B00034G

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices. ...

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符合 RoHS
Bulk 包装
附件
请求编程报价
合规证书

描述

The 375424B00034G is a square pin fin, board-level heat sink intended for the thermal management of BGA and FPGA components. Constructed from aluminum with a black anodize finish, this heat sink measures 15.20 mm in width, 15.30 mm in length, and 6.35 mm in height. It supports both horizontal and vertical mounting orientations for flexible integration. For secure installation and effective thermal transfer, it comes with pre-applied T410R Chomerics thermal tape. This RoHS compliant heat sink is an effective cooling solution for densely packed electronic assemblies requiring heat dissipation for surface-mount devices.

搜索关键词: 375424B00034G

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
Boyd Laconia LLC
部件编号:
375424B00034G
别名/又称:
042987
计量单位:
每 Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
3360
封装类型:
Bulk
器件冷却方式:
BGA6707,FPGA6707
安装方式:
Tape6706
尺寸:
15.2 x 15.2 x 6.356714mm
热阻:
62.56717°C/W
表面处理:
Black Anodized6710

常见问题

375424B00034G 是否符合 RoHS 标准?

是的,375424B00034G 符合 RoHS 标准。

375424B00034G 的交货期是多少?

375424B00034G 的标准交货期约为 6 周。有库存的数量由 Master Electronics 发货。

有存货: 3,512

可立即发货

库存数量的起订量: 25

缺货数量的起订量: 840

工厂交货期 6 周

价格 (USD)

数量
单价
25
$1.093
250
$0.861
500
$0.818
840
$0.810
1,680
$0.808
2,520
$0.806
3,360 +
$0.804

工具/3D模型

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