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375324B00035G by boyd laconia llc
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375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized ...

产品说明书
符合 RoHS 规定
Bulk 包装
附件
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描述

The AAVID THERMALLOY part 375324B00035G is a high-quality, passive heat sink designed to effectively dissipate heat from BGA and FPGA components. It features an extruded adhesive aluminum construction which ensures excellent thermal conductivity and durability. With a thermal resistance of 71.4°C/W, this heat sink efficiently prevents overheating and enables optimal performance of electronic devices. Its black anodized finish not only enhances aesthetics but also provides enhanced corrosion resistance. Invest in this reliable and efficient heat sink for improved thermal management and prolonged component lifespan.

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规格

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供应商:
Boyd Laconia LLC
部件编号:
375324B00035G
Alias/AKA:
035731
计量单位:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
10.2 x 10.2 x 10.26714mm
Thermal Resistance:
71.46717°C/W
Finish:
Black Anodized6710

有存货: 3,316

可立即发货

库存数量的起订量: 5

缺货数量的起订量: 480

工厂交货期 9 周

数量
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
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