ATS-61270D-C1-R0
Advanced Thermal Solutions, IncThe ATS-61270D-C1-R0 is a high-performance fanSINK™ heat sink for BGA components featuring a maxiGRIP™ mechanical attachment system. ...
描述
The ATS-61270D-C1-R0 is a 27.00 x 27.00 x 9.50 mm high-performance fanSINK™ heat sink designed for cooling BGA components. It features X-Cut straightFIN fins that allow for omnidirectional air flow, ensuring optimum thermal performance regardless of the PCB layout. The unit utilizes the proven maxiGRIP™ attachment system, a high-reliability mechanical solution that includes a plastic frame clip and a stainless steel spring clip, avoiding the need for PCB through-holes. This attachment method meets Telecordia GR-63-Core, ETSI 300 019, and MIL-STD-810 shock and vibration standards. The heat sink is supplied with pre-assembled Chomerics T412 thermal interface material, making it a robust and convenient solution for demanding electronic applications.
Search Keywords: ATS61270DC1R0
规格
有存货: 0
已订购:
100
可以发货 6/1/26
Minimum Order Quantity: 5
工厂交货期 8 周
产品指南
English
Chinese
Spanish
