替代产品

替代包装

PIC18F4520T-I/PT

PIC18F4520T-I/PT

有存货: 700
起订量: 50

可能的替代品

PIC18F452-I/PT

有存货: 473
起订量: 5

PIC18F4520-I/PT by microchip technology

图片仅供参考 - 请查看制造商规格

Microchip Technology 授权经销商

PIC18F4520-I/PT

MCU 8 Bit - Flash - PIC18 Family PIC18F45xx Series Microcontrollers - 40 MHz - 32 KB - 1.5 KB - 44 Pins. ...

查看数据表询问数据表

符合 RoHS

TRAY 包装

此产品可能需要额外文件。发货可能会延迟 1-2 天。

描述

The PIC18F4520-I/PT is an 8bit enhanced flash microcontroller with nanoWatt technology in 44 pin TQFP package. The device has one 8bit timer, three 16bit timer, three programmable external interrupts, capture/compare/PWM (CCP) modules, enhanced capture/compare/PWM (ECCP) module and watchdog timer.

产品亮点:

潜在应用:

搜索关键词: PIC18F4520IPT

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

PIC18F4520-I/PT

计量单位:

每 Each

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

3A991.a.2

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

160

封装类型:

TRAY

可编程I/O数量:

34

程序存储器容量:

32 KB

ADC分辨率:

10 bit

工作温度:

-40 to 85 °C

程序存储器类型:

Flash

RAM容量:

1.5 KB

提供不同的包装选项。查看替代品

可用的可能替代选项。查看替代品

有存货: 1,102

可立即发货

BONDED 数量: 0

制造商库存: 0

仅库存批次:

最小订购数量: 5

缺货数量的起订量:

多项: 1

工厂交货期 13 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

5

$6.56

25

$6.34

50

$6.28

160

$6.20

320

$6.19

640

$6.17

1,120 +

$6.16

供应商标准包装

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工具/3D模型

产品指南

Learn more about Microchip Technology Top Selling Microcontrollers and Microprocessors

产品更改

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 06-Mar-2006 -

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 17-Dec-2013 - Microchip is announcing the qualification of palladium coated copper (PdCu) wire at MTAI assembly si

PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 11-May-2022 - ERRATA - PIC18(L)F26/45/46/55/56K42 SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 28-Aug-2009 - MPLAB C FOR PIC18 MCU'S V3.33 RELEASED

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 01-Dec-2005 -

PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa

PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

PCN - 11-Nov-2004 -

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 16-May-2022 - ERRATA - PIC18(L)F26/45/46/55/56K42 SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 08-Mar-2007 -

PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 27-Apr-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS AVAILABLE IN 64L AND AND 44L TQFP PACKAGE

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 24-Jan-2013 - QUALIFICATION OF PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH (PDCU) WIRE AT MTAI ASSEMBLY SITE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 01-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 02-Aug-2021 - PIC18F2420/2520/4420/4520 DATA SHEET REVISION

PCN - 30-Nov-2007 - CHANGE IN BOM

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 01-Apr-2006 - QUALIFICATON OF 44L TQFP AT MMT WITH NEW BILL OF MATERIALS

PCN - 01-Apr-2006 - QUALIFICATON OF 44L TQFP AT MMT WITH NEW BILL OF MATERIALS

PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

PCN - 01-Aug-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 64L AND 44L TQFP (10X10) PACKAGES AT ANAP (ATP) ASSEMBLY SITE

PCN - 19-Apr-2018 - DATA SHEET - PIC18(L)F26/45/46K40 28/40/44-PIN, LOW-POWER HIGH-PERFORMANCE MCU WITH XLP

PCN - 08-Mar-2007 - Product Change Notice

PCN - 01-Dec-2005 - Product Change Notice

PCN - 11-Nov-2004 - Product Change Notice

PCN - 06-Mar-2006 - Product Change Notice

Product Change Notification

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