PIC16C65B-20/P by microchip technology

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Microchip Technology 授权经销商

PIC16C65B-20/P

MCU 8-bit PIC RISC 7KB EPROM 5V 40-Pin PDIP Tube ...

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符合 RoHS

TUBE 包装

描述

The PIC16C65B-20/P is a 8-bit microcontroller unit (MCU) from MICROCHIP TECH. It features a PIC RISC architecture, offering high performance and efficiency. The MCU is equipped with 7KB of EPROM memory, providing ample storage for program code and data. Operating at a voltage range of 5V, it ensures reliable operation in various applications. The PIC16C65B-20/P comes in a 40-pin PDIP package, making it easy to interface with other components on a circuit board. It is supplied in a protective tube packaging, ensuring safe transportation and handling.

产品亮点:

潜在应用:

搜索关键词: PIC16C65B20P

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

PIC16C65B-20/P

计量单位:

每 Each

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

EAR99

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

10

封装类型:

TUBE

RAM容量:

192 B

工作温度:

0 to 70 °C

程序存储器容量:

7 KB

ADC分辨率:

N/A

程序存储器类型:

EPROM

可编程I/O数量:

33

常见问题

PIC16C65B-20/P 是否符合 RoHS 标准？

是的，PIC16C65B-20/P 符合 RoHS 标准。

PIC16C65B-20/P 的交货期是多少？

PIC16C65B-20/P 的标准交货期约为 27 周。有库存的数量由 Master Electronics 发货。

有存货: 300

可立即发货

BONDED 数量: 0

制造商库存: 0

仅库存批次:

库存数量的起订量: 5

缺货数量的起订量: 35

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 1

工厂交货期 27 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

5

$7.72

10

$7.70

25

$7.68

35

$7.66

70

$5.75

105

$5.36

140 +

$5.25

供应商标准包装

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工具/3D模型

产品指南

产品更改

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 10-Oct-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT MMT (ALPH) ASSEMBLY SITE

PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH

PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages

PCN - 18-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages

PCN - 01-Dec-2008 - QUALIFICATION OF 40L PDIP (.6000'') WITH G600 MOLD COMPOUND AT UTL (NSEB) ASSEMBLY

PCN - 08-Mar-2007 - Product Change Notice

PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages With Pdcu

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages

PCN - 27-Sep-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE

PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT

PCN - 01-Dec-2008 - MOLD COMPOUND CHANGE TO G600 & DIE ATTACH EPOXY CHANGE TO 8200T

PCN - 08-Nov-2010 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 05-Nov-2008 - Microchip has qualified G600C Mold compound and 8361J Die attach epoxy for 18L PDIP .300" (Dual Dice

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 11-Nov-2004 - Product Change Notice

PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)

PCN - 06-Mar-2006 - Product Change Notice

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 26-Feb-2009 - Microchip has finally qualified G600C Mold compound and 8200T epoxy for 40L PDIP (.600 mil) at UTL (

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 15-Nov-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 12-Sep-2011 - Qualification Of A Larger Lead Frame Paddle Size In 44L Mqfp Package At Alph (Mmt).

PCN - 01-Apr-2006 - QUALIFICATON OF 44L PLCC AT NEW ASSEMBLY SITE: AIC

Product Change Notification

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