PIC16C558-04/P by microchip technology

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PIC16C558-04/P

Microchip Technology

Microcontroller - PIC 16C - 8-Bit - 4MHz - 13 I/O - 3.5KB (2K x 14) OTP - 128 x 8 RAM - 3 to 5.5V - 18-PDIP. ...

产品说明书

符合 RoHS 规定

TUBE 包装

描述

The PIC16C558-04/P from MICROCHIP TECH. is PIC 16C family 18-Pin PDIP EPROM-Based 8-Bit CMOS microcontroller. The PIC16C558-04/P microcontroller has 3.5KB (2K x 14) OTP program memory, 128 x 8 RAM size and 13 I/O general-purpose I/O pins. This microcontroller operates at a maximum frequency of 4MHz with wide operating voltage of 3 to 5.5V. Operating temperature range is from 0°C to 70°C.

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Potential Applications:

Search Keywords: PIC16C55804P

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产品属性

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选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

PIC16C558-04/P

计量单位:

每 Each

RoHS:

Yes

HTS:

8542310015

COO:

TH

ECCN:

EAR99

供应商标准包装:

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

25

Package Type:

TUBE

有存货: 0

BONDED Quantity: 0

工厂库存: 0

已订购: 350 可以发货 8/31/26

Stock lot only:

库存数量的起订量: 5

缺货数量的起订量: 38

Multiple: 1

工厂交货期 36 周

This product is no longer being manufactured but there may be alternatives. We can help you, 连系我们.

价格 (USD)

数量

单价

5

$8.53

10

$6.83

25

$6.02

38

$6.01

75

$5.69

113

$5.57

150 +

$5.55

供应商标准包装

Log in for special pricing

工具/3D模型

产品指南

产品说明书

Product Changes

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 23-Dec-2011 - Qualification Of 18L Pdip At Alph (Mmt) Assembly Site

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 08-Mar-2007 - Product Change Notice

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 05-Sep-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 06-Mar-2006 - Product Change Notice

PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 15-Mar-2001 - Mtai Change; 18-Lead Pdip (/P) Package Paddle Size From 140X160 Mil To 160X250 For The Picmicro/Sdp

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 27-Jan-2012 - Ccb 1090 Final Notification: Qualification Of 18L Pdip At Alph (Mmt)

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 11-Nov-2004 - Product Change Notice

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ