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25LC256T-I/ST

有存货: 5,000
起订量: 250

25LC256-I/ST by microchip technology

图片仅供参考 - 请查看制造商规格

Microchip Technology 授权经销商

25LC256-I/ST

EEPROM - Serial-SPI - 256Kb (32K x 8) - 3.3V/5V - 8-Pin TSSOP - Tube ...

查看数据表

符合 RoHS

TUBE 包装

描述

The MICROCHIP TECH. part 25LC256-I/ST is an EEPROM memory chip with a capacity of 256Kb, or 32K x 8, suitable for use in various applications. It operates at voltages of 3.3V or 5V, offering versatility in different circuit designs. The chip utilizes a Serial-SPI interface for easy integration into existing systems. Encased in an 8-Pin TSSOP package, this chip provides a compact solution while maintaining reliable performance. It is supplied in a tube packaging, ensuring safe transportation and storage.

产品亮点:

潜在应用:

搜索关键词: 25LC256IST

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

25LC256-I/ST

计量单位:

每 Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

EAR99

供应商标准包装:

此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。

100

封装类型:

TUBE

数据保持:

200(Min) Year

常见问题

25LC256-I/ST 是否符合 RoHS 标准？

是的，25LC256-I/ST 符合 RoHS 标准。

25LC256-I/ST 的交货期是多少？

25LC256-I/ST 的标准交货期约为 5 天。有库存的数量由 Master Electronics 发货。

提供不同的包装选项。查看替代品

有存货: 2,050

可立即发货

BONDED 数量: 0

制造商库存: 0

仅库存批次: 50

最小订购数量: 100

缺货数量的起订量:

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 100

工厂交货期 5 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

100

$1.63

300

$1.62

500

$1.60

1,000

$1.59

2,500

$1.58

5,000

$1.57

7,500

$1.56

10,000 +

$1.55

供应商标准包装

登录以获取特别价格

工具/3D模型

产品指南

产品更改

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE

PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 19-Mar-2007 -

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 28-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 12-Apr-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Jan-2013 - DATA SHEET - 25AA256/25LC256 DEVICE DATA SHEET

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 08-Jan-2013 - Microchip has released a new devicedoc for the 25AA256/25LC256 device data sheet of devices.

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 23-Jul-2021 - DATA SHEET - 25AA256/25LC256 256K SPI BUS SERIAL EEPROM

PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

PCN - 13-Jul-2006 -

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 28-Aug-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 25AA256/25LC256 DEVICE DATA SHEET OF DEVICES

PCN - 15-Oct-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag

PCN - 28-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH BOND WIRE FOR SELECTED PRODUCTS

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

PCN - 03-Jun-2004 -

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

PCN - 01-Feb-2006 -

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 18-Sep-2018 - 25LCXXX 8K-256K SPI SERIAL EEPROM HIGH TEMP FAMILY DATA SHEET

PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 06-Mar-2006 -

PCN - 11-Nov-2004 -

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

PCN - 15-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE

PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

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