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替代包装

25AA1024-I/SM

有存货: 6,143
起订量: 5

25AA1024T-I/SM by microchip technology

图片仅供参考 - 请查看制造商规格

Microchip Technology 授权经销商

25AA1024T-I/SM

EEPROM Memory - 1Mbit - 128K x 8 Memory Organization - SPI Memory Interface - 20 MHz - 6ms - 1.8V to 5.5V Supply - 8-SOIJ Package - Surface Mount. ...

查看数据表询问数据表

符合 RoHS

REEL 包装

此产品可能需要额外文件。发货可能会延迟 1-2 天。

描述

The 25AA1024T-I/SM from Microchip Technology is surface mount EEPROM memory with 1Mbit memory size, 128K x 8 memory organization, 20 MHz clock frequency and 6ms write cycle time. This EEPROM memory has SPI memory interface and comes in 8-pin SOIJ package. The 25AA1024T-I/SM has wide supply voltage range from 1.8V to 5.5V. Operating temperature range is from -40°C to 85°C.

产品亮点:

潜在应用:

搜索关键词: 25AA1024TISM

规格

产品属性

属性值

选择属性

找到的产品: 0

供应商:

Microchip Technology

部件编号:

25AA1024T-I/SM

计量单位:

每 Each

RoHS:

Yes

HTS:

8542320051

COO:

TH

ECCN:

3A991.b.1.b.2

卷盘包装:

此信息适用于希望按制造商标准包装数量的倍数购买的客户。最低订购数量和要求的订购倍数会与价格和库存信息一同显示。

2100

封装类型:

REEL

数据保持:

200(Min) Year

提供不同的包装选项。查看替代品

有存货: 7,808

可立即发货

BONDED 数量: 0

制造商库存: 0

仅库存批次:

库存数量的起订量: 100

缺货数量的起订量: 525

此消息模板用于通知联盟会员某个订单已付款。当金额被扣款时，订单会获得已付款状态。: 1

工厂交货期 17 周

此产品已不再生产，但可能有替代品。我们可以帮助您, 连系我们.

价格 (USD)

数量

单价

100

$10.60

250

$10.57

525

$10.55

1,050

$5.57

1,575

$3.83

2,100 +

$3.75

卷盘包装

登录以获取特别价格

工具/3D模型

产品指南

产品更改

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 06-Mar-2006 -

PCN - 24-May-2010 - Microchip has released a new DeviceDoc for the 25AA1024 Device Data Sheet of devices.

PCN - 24-May-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

PCN - 08-Nov-2010 - QUALIFICATION OF 8L SOIJ PACKAGE WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat

PCN - 18-Oct-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 11-Nov-2004 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD

PCN - 02-Nov-2007 - CHANGE IN BOM

PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 22-Oct-2013 - PCN REVISED: REMOVED DEVICES FROM THE FINAL NOTIFICATION

PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 14-Oct-2021 - DATA SHEET - 25AA1024 1 MBIT SPI BUS SERIAL EEPROM DEVICE DATA SHEET DOCUMENT REVISION

PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

PCN - 11-Nov-2004 -

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 06-Feb-2010 - DATA SHEET-25AA1024 DEVICE DATA SHEET

PCN - 07-Oct-2005 -

PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

PCN - 13-Jun-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8L SOIJ package products with SG-8300GM mold com

PCN - 06-Mar-2006 - Product Change Notice

PCN - 11-Nov-2004 - Product Change Notice

PCN - 07-Oct-2005 - Product Change Notice

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