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7141DG
Heat Sink Passive TO-220 Vertical Thru-Hole Copper 20.3A°C/W Matte Tin ...
描述
The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.
搜索关键词: 7141DG
规格
常见问题
7141DG 是否符合 RoHS 标准？
是的，7141DG 符合 RoHS 标准。
7141DG 的交货期是多少？
7141DG 的标准交货期约为 6 周。有库存的数量由 Master Electronics 发货。
数据表
