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7023B-MTG by boyd laconia llc
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Boyd Laconia LLC 授权经销商

7023B-MTG

Heat Sink Passive TO-220 Folded Back Thru-Hole Aluminum 4.4A°C/W Black Anodized ...

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符合 RoHS
Bulk 包装
附件
请求编程报价
合规证书

描述

The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.

搜索关键词: 7023BMTG

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
Boyd Laconia LLC
部件编号:
7023B-MTG
别名/又称:
042270
计量单位:
每 Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
300
封装类型:
Bulk
器件冷却方式:
TO-2206707
安装方式:
Clip/Solder Tab6706
尺寸:
48.26 x 24.13 x 44.456714mm
热阻:
4.46717°C/W
表面处理:
Black Anodized6710

常见问题

7023B-MTG 是否符合 RoHS 标准？

是的，7023B-MTG 符合 RoHS 标准。

7023B-MTG 的交货期是多少？

7023B-MTG 的标准交货期约为 6 周。有库存的数量由 Master Electronics 发货。

有存货: 5,554

可立即发货

最小订购数量: 5

工厂交货期 6 周

价格 (USD)

数量
单价
5
$8.36
25
$7.19
50
$6.71
100
$6.22
300
$5.85
600
$5.64
1,200
$5.43
2,700 +
$5.42
供应商标准包装
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