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593202B03500G by boyd laconia llc
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593202B03500G

Boyd Laconia LLC

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

产品说明书
符合 RoHS 规定
Bulk 包装
附件
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描述

The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.

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规格

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供应商:
Boyd Laconia LLC
部件编号:
593202B03500G
Alias/AKA:
042686
计量单位:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized

有存货: 835

可立即发货

已订购: 8,000   可以发货 5/28/26 

库存数量的起订量: 5

缺货数量的起订量: 400

工厂交货期 13 周

数量
Unit Price
5
$2.776
100
$0.708
250
$0.694
400
$0.667
800
$0.649
1,200
$0.646
1,600 +
$0.642
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