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573300D00010G
Boyd Laconia LLCHeat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...
描述
The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
Search Keywords: 573300D00010G
规格
有存货: 7,371
可立即发货
库存数量的起订量: 5
缺货数量的起订量: 750
工厂交货期 9 周
Tools/3D Models
产品说明书
Learn more about BOYD Board Level Heat Sinks
