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513202B02500G
The 513202B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 semiconductor devices. ...
描述
The 513202B02500G is a dual radial, board-level heat sink from the Extruded 5000 series, specifically designed for the thermal management of TO-220 packaged devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 50.80 mm in height and 34.92 mm in width. It features solderable pins for secure board attachment and can be mounted in either a horizontal or vertical orientation. This component is ideal for applications requiring efficient heat dissipation from power components on a printed circuit board, ensuring device reliability and performance.
搜索关键词: 513202B02500G
规格
常见问题
513202B02500G 是否符合 RoHS 标准？
是的，513202B02500G 符合 RoHS 标准。
513202B02500G 的交货期是多少？
513202B02500G 的标准交货期约为 8 周。有库存的数量由 Master Electronics 发货。
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