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375424B00034G by boyd laconia llc
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375424B00034G

Boyd Laconia LLC

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices. ...

产品说明书
符合 RoHS 规定
Bulk 包装
附件
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描述

The 375424B00034G is a square pin fin, board-level heat sink intended for the thermal management of BGA and FPGA components. Constructed from aluminum with a black anodize finish, this heat sink measures 15.20 mm in width, 15.30 mm in length, and 6.35 mm in height. It supports both horizontal and vertical mounting orientations for flexible integration. For secure installation and effective thermal transfer, it comes with pre-applied T410R Chomerics thermal tape. This RoHS compliant heat sink is an effective cooling solution for densely packed electronic assemblies requiring heat dissipation for surface-mount devices.

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规格

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供应商:
Boyd Laconia LLC
部件编号:
375424B00034G
Alias/AKA:
042987
计量单位:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710

有存货: 334

可立即发货

已订购: 3,360   可以发货 6/11/26 

Minimum Order Quantity: 25

工厂交货期 6 周

数量
Unit Price
25
$1.121
250
$0.821
500
$0.778
1,000
$0.771
3,360
$0.767
6,720
$0.763
10,080
$0.759
16,800 +
$0.755
Suppliers Standard Package
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