描述

The 10078902-001LF is a high-power backplane/midplane connector module designed for chassis-based equipment platforms requiring increased power density at the daughter card-to-backplane interface. This 3-contact module features a current rating of 75A per contact (225A total module current) with a maximum temperature rise of 30°C in still air, and operates at 300V with a dielectric withstanding voltage of 2500V. The module incorporates proven stamped-and-formed HCI power contact technology with matte tin over nickel termination, achieving contact resistance of =0.5mO initially and after environmental exposure. With a column pitch of 7.3mm and module width of 22.9mm along the card edge, it provides compact integration for high-density power applications. The connector is rated for 200 durability cycles and complies with UL 60950, CSA, TUV, and Telcordia GR-1217-CORE standards, making it suitable for telecommunications central office equipment and other demanding power distribution scenarios.