Login
EN
English
中文 / 汉语
Deutsch
Español
Nederlands
2101041-1
EMI spring with no-snag design and peel-and-stick adhesive backing for electromagnetic interference shielding applications. ...
DESCRIPTION
The 2101041-1 is an A600 EMI spring designed with a no-snag feature and peel-and-stick adhesive backing for easy installation in electromagnetic shielding applications. This component is engineered to provide effective EMI suppression while minimizing snagging during assembly and deployment. The product is wave solder capable to 265°C, enabling integration into standard manufacturing processes. It is compliant with EU RoHS Directive 2011/65/EU and contains no restricted substances above threshold limits, meeting stringent environmental and regulatory requirements. The peel-and-stick design simplifies installation in confined spaces and reduces assembly time, making it ideal for consumer electronics, telecommunications equipment, and industrial devices requiring reliable EMI containment.
Search Keywords: 21010411
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is 2101041-1 RoHS compliant?
Yes, 2101041-1 is RoHS compliant.
What is the lead time for 2101041-1?
The standard lead time for 2101041-1 is approximately 9 days. In-stock quantities ship from Master Electronics.
There is currently no price for this item. Click below to request pricing. You will receive a quotation via e-mail within 24-48 hours.
Request Pricing �
IN STOCK: 344
Can Ship immediately
Minimum Order Quantity: 25
Factory Lead-Time 9 Weeks
Datasheet