1318745-2
025 I/O CAP HSG ASSY 32P ...
DESCRIPCIÓN
The 1318745-2 is a 32-position I/O connector cap housing assembly designed for automotive, truck, bus, and off-road applications. It features a 2-row configuration with a 0.087 inch (2.2 mm) centerline pitch and tab dimensions of 0.64 mm width and thickness, utilizing tin (Sn) interface plating for reliable electrical contact. The connector operates at a nominal voltage of 12 VDC with a maximum voltage rating of 12 VDC and supports through-hole solder termination on PCBs with a recommended thickness of 1.6 mm. With a profile height of 15.5 mm from the PCB, overall dimensions of 40.6 mm width by 18.4 mm length, and an operating temperature range of -30°C to +105°C, this connector is well-suited for harsh automotive environments requiring robust signal transmission and mechanical durability.
Características destacadas:
- Housing Assembly
- Receptacle (Cap)
- Receptacle Configuration = 025
- Number of Positions = 32
- Mount = Printed Circuit Board
Palabras clave de búsqueda: 13187452
ESPECIFICACIONES
PREGUNTAS FRECUENTES
¿Cumple 1318745-2 con la normativa RoHS?
Sí, 1318745-2 cumple con la normativa RoHS.
¿Cuál es el plazo de entrega de 1318745-2?
El plazo de entrega estándar de 1318745-2 es de aproximadamente 20 semanas. Las cantidades disponibles se envían desde Master Electronics.
EN STOCK: 689
Envío today, Introduzca el valor de la configuración.
MOQ para Cantidad en Stock: 10
MOQ para cantidad agotada: 97
Plazo de entrega de fábrica 20 Semanas
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