HTS285NF-D
Heat Sink Passive BGA Pin Array Cold-Forged Aluminum Black Anodized ...
DESCRIPTION
HTS285NF-D is a BGA heat sink assembly designed for thermal management of BGA semiconductor packages. The unit features a cold-forged aluminum construction with a 50.80 mm diameter and 19.05 mm height, providing efficient heat dissipation in compact form factors. It includes a four-leg standard mounting clip (Part Number 1542026-1) that does not increase the overall heat sink height, enabling seamless integration into space-constrained applications. The assembly is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink is ideal for high-performance computing, telecommunications, and industrial applications where reliable thermal management of BGA packages is critical.
Search Keywords: HTS285NFD
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is HTS285NF-D discontinued?
Yes, HTS285NF-D from Te Connectivity / Chip Coolers Brand is discontinued. Master Electronics is an authorized distributor and may have remaining stock or a recommended replacement for it.
Is HTS285NF-D RoHS compliant?
Yes, HTS285NF-D is RoHS compliant.
What is the lead time for HTS285NF-D?
The standard lead time for HTS285NF-D is approximately 10 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 40
Can Ship immediately
Minimum Order Quantity: 4
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