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375424B00034G by boyd laconia llc
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Boyd Laconia LLC Authorized Distributor

375424B00034G

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices. ...

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RoHS Compliant
Bulk Packaging
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Certificate of Compliance

DESCRIPTION

The 375424B00034G is a square pin fin, board-level heat sink intended for the thermal management of BGA and FPGA components. Constructed from aluminum with a black anodize finish, this heat sink measures 15.20 mm in width, 15.30 mm in length, and 6.35 mm in height. It supports both horizontal and vertical mounting orientations for flexible integration. For secure installation and effective thermal transfer, it comes with pre-applied T410R Chomerics thermal tape. This RoHS compliant heat sink is an effective cooling solution for densely packed electronic assemblies requiring heat dissipation for surface-mount devices.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
Alias/AKA:
042987
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710

FREQUENTLY ASKED QUESTIONS

Is 375424B00034G RoHS compliant?

Yes, 375424B00034G is RoHS compliant.

What is the lead time for 375424B00034G?

The standard lead time for 375424B00034G is approximately 6 weeks. In-stock quantities ship from Master Electronics.

IN STOCK: 3,512

Can Ship immediately

MOQ for In Stock Qty: 25

MOQ for out of Stock Qty: 840

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
25
$1.093
250
$0.861
500
$0.818
840
$0.810
1,680
$0.808
2,520
$0.806
3,360 +
$0.804
Supplier's Standard Package
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