HTS768-U
HTS768-U=25MM HS ASSY ULTEM CL ...
DESCRIPTION
The HTS768-U is a heat sink assembly designed for use with BGA (Ball Grid Array) semiconductor packages. It features a 3-fin radial design with black anodized aluminum construction, providing efficient thermal management for high-performance applications. The assembly has a diameter of 34.92 mm (1.375 in) and a height of 11.86 mm (0.467 in), with a package size of 25 mm (0.985 in), and includes a four-leg standard mounting clip that does not increase the overall heat sink height. The product is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink assembly is ideal for thermal management in compact electronic systems where space constraints and reliable heat dissipation are critical requirements.
Search Keywords: HTS768U
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is HTS768-U discontinued?
Yes, HTS768-U from Te Connectivity / Chip Coolers Brand is discontinued (end-of-life December 2016). Master Electronics is an authorized distributor and may have remaining stock or a recommended replacement for it.
Is HTS768-U RoHS compliant?
Yes, HTS768-U is RoHS compliant.
What is the lead time for HTS768-U?
The standard lead time for HTS768-U is approximately 6 days. In-stock quantities ship from Master Electronics.
IN STOCK: 195
Can Ship immediately
Minimum Order Quantity: 2
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