HTS191-P
Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
DESCRIPTION
HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.
Product Highlights:
- Heat Sink
- BGA
- Package Size = 25 [.985] mm [in]
- For Use With BGA Semiconductor Packages
- Diameter = 25.00 mm
Search Keywords: HTS191P
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is HTS191-P discontinued?
Yes, HTS191-P from Te Connectivity / Chip Coolers Brand is discontinued (end-of-life January 2022). Master Electronics is an authorized distributor and may have remaining stock or a recommended replacement for it.
Is HTS191-P RoHS compliant?
Yes, HTS191-P is RoHS compliant.
What is the lead time for HTS191-P?
The standard lead time for HTS191-P is approximately 8 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 232
Can Ship immediately
Minimum Order Quantity: 6
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