2227838-7

The 2227838-7 is a thermally enhanced, 2x8 stacked zSFP+ pluggable I/O interconnect assembly. ...

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TRAY Packaging

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DESCRIPTION

The 2227838-7 is a thermally enhanced, 2x8 stacked zSFP+ interconnect assembly designed for high-speed data transmission. It operates with a maximum voltage of 120V AC, a maximum current of 0.5A, and has a dielectric withstanding voltage of 300V AC between contacts. The assembly features a high-temperature thermoplastic housing, a nickel silver cage, and high-performance copper alloy contacts with 30” Gold plating on the mating area. Designed for a minimum PCB thickness of 1.57mm and rated for at least 100 mating cycles, this interconnect is suitable for applications in telecommunications, data centers, and networking equipment requiring high density and reliable performance over an operating temperature range of -40°C to +85°C.

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Supplier:

TE Connectivity / AMP Brand

Part No:

2227838-7

Unit of Measure:

Per Each

RoHS:

Yes

HTS:

8536694040

COO:

ECCN:

EAR99

Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.