642-25AB
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized ...
DESCRIPTION
The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.
Search Keywords: 64225AB
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
What replaces 642-25AB?
The recommended replacement for 642-25AB is 641K from Wakefield, available from Master Electronics.
Is 642-25AB RoHS compliant?
Yes, 642-25AB is RoHS compliant.
What is the lead time for 642-25AB?
The standard lead time for 642-25AB is approximately 16 days. In-stock quantities ship from Master Electronics.
IN STOCK: 29
Can Ship immediately
Minimum Order Quantity: 10
Factory Lead-Time 16 Weeks
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