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HTS768-U by te connectivity / chip coolers brand
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HTS768-U

TE Connectivity / Chip Coolers Brand

HTS768-U=25MM HS ASSY ULTEM CL ...

Datasheet
RoHS Compliant
Packaging
Accessories
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Discontinued
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DESCRIPTION

The HTS768-U is a heat sink assembly designed for use with BGA (Ball Grid Array) semiconductor packages. It features a 3-fin radial design with black anodized aluminum construction, providing efficient thermal management for high-performance applications. The assembly has a diameter of 34.92 mm (1.375 in) and a height of 11.86 mm (0.467 in), with a package size of 25 mm (0.985 in), and includes a four-leg standard mounting clip that does not increase the overall heat sink height. The product is RoHS and ELV compliant with a UL 94V-0 flammability rating, ensuring compliance with environmental and safety standards. This heat sink assembly is ideal for thermal management in compact electronic systems where space constraints and reliable heat dissipation are critical requirements.

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SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS768-U
Alias/AKA:
5-1542004-8
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
25
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 195

Can Ship immediately

Minimum Order Quantity: 2

Price (USD)

Qty
Unit Price
2
$30.42
25
$28.90
88
$27.45
175
$14.62
263
$10.27
350 +
$10.06
Suppliers Standard Package
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