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HTS654-U by te connectivity / chip coolers brand
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HTS654-U

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Aluminum Black Anodized ...

Datasheet
RoHS Compliant
Tray Packaging
Accessories
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Discontinued
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DESCRIPTION

The HTS654-U is a heat sink assembly engineered for thermal management of BGA semiconductor packages. It features a 7-fin radial design constructed from aluminum with a black anodize finish, providing effective heat dissipation across a range of operating conditions. The assembly has a package size of 21 mm, a diameter of 34.92 mm, and a height of 22.70 mm, with a flammability rating of UL 94V-0. Thermal resistance varies from 10.56°C/W at 0 LFM to 2.06°C/W at 600 LFM depending on power dissipation levels (5W to 15W), making it suitable for applications requiring efficient passive cooling in compact form factors. The integrated two-leg mounting clip simplifies installation without increasing overall heat sink height, and the product is RoHS and ELV compliant.

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SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS654-U
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
22.7 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 130

Can Ship immediately

Minimum Order Quantity: 3

Price (USD)

Qty
Unit Price
3
$21.86
15
$21.46
30
$21.06
60
$20.64
450
$20.25
500 +
$14.17
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