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HTS248-U by te connectivity / chip coolers brand
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HTS248-U

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

Datasheet
RoHS Compliant
Box Packaging
Accessories
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Discontinued
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DESCRIPTION

HTS248-U is a heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a diameter of 34.92 mm (1.375 in) and a height of 13.87 mm (0.546 in), supporting power dissipation ratings of 5W, 10W, and 15W. Thermal resistance values range from 2.9°C/W to 10.98°C/W depending on operating conditions. This heat sink is EU RoHS and ELV compliant with exemptions and carries a UL 94V-0 flammability rating, making it suitable for applications requiring reliable thermal solutions for BGA devices.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 35 [1.379] mm [in]
  • For Use With BGA Semiconductor Packages
  • Power Air Velocity Thermal Resistance

Search Keywords: HTS248U

SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS248-U
Alias/AKA:
9-1542000-4
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Box
Device Cooled:
BGA6707
Attachment Method:
Clip6706
Dimension:
13.87 x 34.926714mm
Thermal Resistance:
N/A
Finish:
Black Anodized6710
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 500

Can Ship immediately

Minimum Order Quantity: 3

Price (USD)

Qty
Unit Price
3
$22.26
15
$21.85
30
$21.43
59
$21.02
250
$20.60
500 +
$14.42
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