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HTS191-P by te connectivity / chip coolers brand
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HTS191-P

TE Connectivity / Chip Coolers Brand

Heat Sink Passive BGA Radial Clip Aluminum Black Anodized ...

Datasheet
RoHS Compliant
Tray Packaging
Accessories
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Discontinued
This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

HTS191-P is a heat sink assembly designed for thermal management of BGA semiconductor packages. This 25mm heat sink features a 2 fin radial design constructed from aluminum with a black anodize finish for enhanced heat dissipation. The product is EU RoHS/ELV compliant, ensuring environmental compliance for electronic applications. It is commonly used in applications requiring efficient cooling of BGA devices, providing reliable thermal performance in electronic systems.

Product Highlights:

  • Heat Sink
  • BGA
  • Package Size = 25 [.985] mm [in]
  • For Use With BGA Semiconductor Packages
  • Diameter = 25.00 mm

Search Keywords: HTS191P

SPECIFICATIONS

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Products found: 0
Supplier:
TE Connectivity / Chip Coolers Brand
Part No:
HTS191-P
Alias/AKA:
5-1542000-6
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Tray
Life Cycle:
Discontinued
  This product is discontinued, but still in stock

IN STOCK: 464

Can Ship immediately

Minimum Order Quantity: 6

Price (USD)

Qty
Unit Price
6
$18.58
27
$17.70
110
$16.89
270
$16.16
790 +
$15.48
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