HTS186-U
TE Connectivity / Chip Coolers BrandHeat Sink Passive BGA Radial Clip Aluminum Black Anodized ...
DESCRIPTION
HTS186-U is a 21mm heat sink assembly designed for thermal management of BGA semiconductor packages. It features a radial fin style with 4 fins, constructed from aluminum with a black anodized plating for enhanced heat dissipation. The heat sink has a height of 13.97 mm, diameter of 25.4 mm, and supports power ratings of 5W, 10W, and 15W depending on airflow conditions. The assembly includes a two-leg mounting clip (Part Number 1542431-1) that does not increase overall heat sink height. This EU RoHS and ELV compliant component is ideal for cooling BGA devices in applications requiring efficient thermal solutions with UL 94V-0 flammability rating.
Search Keywords: HTS186U
SPECIFICATIONS
IN STOCK: 1,774
Can Ship immediately
Minimum Order Quantity: 10
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