DESCRIPTION

The 820-AG11D-LF is a 20-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features a standard profile with a ladder frame style, beryllium copper contacts with gold plating in the mating area, and screw machine contact style with four-fingered mating configuration. The socket has a row-to-row spacing of 7.62 mm, centerline spacing of 2.54 mm, and a height above the PCB of 2.67 mm, with solder tail contacts plated in tin and a post length of 3.18 mm. Electrical performance includes an insulation resistance of 5,000 MO and contact resistance of 10 mO, with operation across a temperature range of -55°C to +105°C. The housing is constructed from thermoplastic polyester with UL 94V-0 flammability rating and is RoHS/ELV compliant, making it suitable for industrial and commercial applications requiring reliable IC socket connections.