514-AG11D
TE Connectivity / Buchanan BrandDIP Sockets ...
DESCRIPTION
The 514-AG11D is a 14-position DIP socket designed for vertical thru-hole mounting on printed circuit boards. It features beryllium copper screw machine contacts with gold plating (25 µin) and a four-fingered mating contact style, providing reliable electrical connection and mechanical retention for dual in-line package (DIP) integrated circuits. The socket has a row-to-row spacing of 7.62 mm (0.300 in) with a centerline of 2.54 mm (0.100 in) and a height above the PCB of 4.57 mm (0.180 in). It is wave solder capable up to 265°C and operates reliably at temperatures up to 125°C, making it suitable for standard industrial and commercial applications requiring secure IC component insertion and removal.
Product Highlights:
- DIP Socket
- Number of Positions = 14
- Row-to-Row Spacing = 7.62 mm
- Thru Hole
- Mount Style = Vertical
Search Keywords: 514AG11D
SPECIFICATIONS
IN STOCK: 2,534
Can Ship immediately
Minimum Order Quantity: 45
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