HSB28-606022
Same Sky®’s60 x 60 mm - BGA Heat Sink - Aluminum - PCB ...
DESCRIPTION
HSB28-606022 is a BGA-design heat sink engineered for efficient thermal dissipation in compact electronic assemblies. Constructed from AL 6063-T5 aluminum alloy with black anodized finish, it features a top-mount configuration with push-pin attachment mechanism and spring steel fasteners. The heat sink delivers thermal resistance of 4.5°C/W at 1 W under natural convection, improving to 1.7°C/W at 200 LFM and 1.1°C/W at 400 LFM airflow, with maximum power dissipation of 14.10 W at 75°C temperature differential. Weighing 107.96 g with dimensions of 60.00 × 53.00 mm, it is ideal for applications requiring reliable thermal management in space-constrained environments such as high-performance computing, telecommunications, and industrial electronics.
Search Keywords: HSB28606022
SPECIFICATIONS
IN STOCK: 80
Can Ship immediately
Minimum Order Quantity: 5
Factory Lead-Time 14 Weeks
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