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MCP6004T-E/ST

ALTERNATIVE PRODUCTS

Alternative Packaging

MCP6L04T-E/ST

In Stock: 5,000
Minimum Order: 1,000

Possible Replacement

MCP6004-E/ST

In Stock: 1,248
Minimum Order: 96

MCP6004T-E/ST by microchip technology

Image is representational - see manufacturer specifications

Microchip Technology Authorized Distributor

MCP6004T-E/ST

Quad Op Amp - Low Power - 1MHz GBP - 1.8 to 6.0 VDC - Rail to Rail I/O - 14-lead TSSOP - -40°C to +125°C

Ask the Datasheet

RoHS Compliant

REEL Packaging

DESCRIPTION

The MCP6004T-E/ST is a low power quad operational amplifier, designed for general-purpose applications. Extended temp. range -40°C-125°C. Package type is a Plastic TSSOP, (4.4 mm body), 14-lead.

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SPECIFICATIONS

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Products found: 0

Supplier:

Microchip Technology

Part No:

MCP6004T-E/ST

Unit of Measure:

Per Each

RoHS:

Yes

HTS:

8542330001

COO:

TH

ECCN:

EAR99

Reel Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

2500

Package Type:

REEL

Dimension:

5 x 4.4 x 1 mm

FREQUENTLY ASKED QUESTIONS

What replaces MCP6004T-E/ST?

The recommended replacement for MCP6004T-E/ST is MCP6004-E/ST from Microchip Technology, available from Master Electronics.

Is MCP6004T-E/ST RoHS compliant?

Yes, MCP6004T-E/ST is RoHS compliant.

What is the lead time for MCP6004T-E/ST?

The standard lead time for MCP6004T-E/ST is approximately 5 weeks. In-stock quantities ship from Master Electronics.

Different packaging options available. See Alternatives

Possible Replacement options available. See Alternatives

IN STOCK: 6,442

Ships today, if you order in

BONDED Quantity: 0

Manufacturer Stock: 0

Stock lot only:

Minimum Order Quantity: 500

MOQ for out of Stock Qty:

Multiple: 1

Factory Lead-Time 5 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price (USD)

Qty

Unit Price

500

$0.4884

1,000

$0.4346

2,500

$0.4293

5,000

$0.4282

7,500

$0.4272

10,000

$0.4261

15,000

$0.4250

25,000 +

$0.4240

Reel Package

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Tools/3D Models

Product Guides

Product Changes

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 19-Nov-2009 - Microchip has released a new DeviceDoc for the MCP6001/R/U/2/4, 1 MHz, Low-Power Op Amp of devices.

PCN - 13-Jul-2006 - Product Change Notice

PCN - 06-Sep-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa

PCN - 12-Apr-2012 - Microchip Is Announcing The Qualification Of Mmt (Alph) Assembly Site For The Listed 14L Tssop Packa

PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic

PCN - 22-Jan-2004 - Qualify Unisem For Assembly Of 14L Tssop Package

PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)

PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly

PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads

PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 20-Feb-2007 - Product Change Notice

PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.

PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP

PCN - 11-Nov-2004 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 18-Aug-2012 - Qualification Of 14L Tssop Package At Mmt (Alph) Assembly Site

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 30-Apr-2007 - Product Change Notice

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 19-Mar-2007 - Product Change Notice

PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

Product Change Notification

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