MCP2515-I/P by microchip technology

MCP2515-I/P

Microchip Technology

CanBus Controller - 1Mbps - 3.3V/5V - Sleep/Standby - PDIP - 18-Pin. ...

RoHS Compliant

TUBE Packaging

DESCRIPTION

The MCP2515-I/P is a stand-alone controller area network (CAN) Controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames. The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCU's overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). The device consists of three main blocks, that is CAN module, which includes the CAN protocol engine, masks, filters, transmit and receive buffers. The control logic and registers that are used to configure the device and its operation and the SPI protocol block.

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SPECIFICATIONS

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Supplier:

Microchip Technology

Part No:

MCP2515-I/P

RoHS:

Yes

HTS:

8542390090

COO:

TH

ECCN:

EAR99

Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.

25

Package Type:

TUBE

Family:

MCP2515

Dimension:

22.86 x 6.35 x 3.3 mm

Category:

Controller

IN STOCK: 600

Can Ship immediately

BONDED Quantity: 0

Manufacturer Stock: 0

Minimum Order: 25

Available in less than min:

MOQ for out of Stock Qty:

Multiple: 25

Factory Lead-Time 4 Weeks

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Qty

Unit Price

25

$2.11

100

$2.02

250

$1.98

500

$1.95

1,000

$1.92

2,500 +

$1.89

Suppliers Standard Package

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Tools/3D Models

Product Guides

Part Status Change - 20-Aug-2020 - Status changed from Active to NRFND

Product Changes

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 29-Jan-2019 - DATA SHEET - MCP2515 STAND-ALONE CAN CONTROLLER WITH SPI INTERFACE DATA SHEET

PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DOCUMENT REVISION

PCN - 17-Nov-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE MCP2515 DATA SHEET OF DEVICES.

PCN - 08-Nov-2010 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 18-Dec-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 22-Sep-2011 - QUALIFICATION OF 18L PDIP AT ALPH (MMT) ASSEMBLY SITE

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

PCN - 18-Sep-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 18L PDI

PCN - 13-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

PCN - 09-Dec-2016 - DATA SHEET - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 05-Aug-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES

PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB

PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 17-Nov-2010 - Microchip has released a new DeviceDoc for the listed MCP2515 Data Sheet of devices.

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 07-Oct-2005 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Aug-2013 - Microchip is announcing the qualification of the listed products available in the 28L SPDIP, 8L PDIP

PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 06-Nov-2003 -

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 22-Apr-2021 - DOCUMENT CHANGE

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

PCN - 18-Dec-2013 - Microchip is announcing the qualification of the listed products in the 28L SPDIP, 8L PDIP, and 18L

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

PCN - 07-Oct-2005 - 18L SOIC 300'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

PCN - 16-Dec-2005 - QUALIFICATION OF 20L TSSOP PACKAGE AT NSEB

PCN - 13-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

PCN - 23-Aug-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

PCN - 10-Jan-2018 - MCP2515 SILICON ERRATA DOCUMENT REVISION

PCN - 28-Aug-2012 - MCP2515 DATA SHEET DATA SHEET DOCUMENT REVISION

PCN - 20-Jan-2012 - CCB 1090 FINAL NOTIFICATION: QUALIFICATION OF 18L PDIP AT ALPH (MMT)

PCN - 06-Feb-2014 - Microchip is announcing the qualification of selected products available in the 28L SPDIP, 8L PDIP,

PCN - 26-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

PCN - 25-May-2016 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

PCN - 28-Aug-2012 - Microchip has released a new devicedoc for the MCP2515 data sheet of devices in order to improve pro

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

PCN - 18-Sep-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

PCN - 11-Nov-2004 -