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4865-454G
MG Chemicals* Meets J-STD-004 and QQ-S-571 * No Clean * Standard Flux Core percentage at 2.2% * Melting Point: 183 ° C / 361 ° F ...
DESCRIPTION
4865 Sn63/Pb37 No-Clean Solder Wires is electronics grade solder wire. This no-clean solder wire uses the standard eutectic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, splatter-proof, resin flux core. It meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 63/37 solder wire is one of the easiest solders to work with because it combines a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.This leaded solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.For Sn63/Pb37 RA solder wire try 4880-4888. We also offer Sn60/Pb40 No-Clean Solder Wire and Sn60/Pb40 RA Solder Wire.For a lead-free solder wire try 4900-4917, 4901, or 49500WS.
Search Keywords: 4865454G
SPECIFICATIONS
IN STOCK: 9
Can Ship immediately
Minimum Order Quantity: 3
Multiple: 3
Factory Lead-Time 2 Weeks
Datasheet
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