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7717-107DAPG by boyd laconia llc

7717-107DAPG

Boyd Laconia LLC

Heat Sinks Semiconductor Pad for Circuits, DAP, 8 Leads, 10.92mm Outer Dia., 3.30mm Thick ...

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RoHS Compliant
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DESCRIPTION

This BOYD LACONIA LLC Heat Sinks Semiconductor Pad is designed for circuits, specifically for use with DAP applications. It features 8 leads, a 10.92mm outer diameter, and is 3.30mm thick, making it ideal for effectively dissipating heat from semiconductor devices. This high-quality pad ensures optimal performance and longevity for your electronic components.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
7717-107DAPG
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
US
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1000

IN STOCK: 1,517

Can Ship immediately

Minimum Order Quantity: 25

Factory Lead-Time 16 Weeks

Price (USD)

Qty
Unit Price
25
$1.302
100
$1.184
250
$1.165
500
$1.138
1,000
$1.114
3,000
$1.033
5,000
$0.713
8,000 +
$0.708
Suppliers Standard Package
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