7023B-MTG
Heat Sink Passive TO-220 Folded Back Thru-Hole Aluminum 4.4A°C/W Black Anodized ...
DESCRIPTION
The 7023B-MTG is a channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish, this heat sink features a vertical mounting orientation and requires a mounting kit for device attachment. The heat sink dimensions are 48.26 mm width, 24.13 mm length, and 49.53 mm height, with mounting hole specifications of X: 13.97 mm (0.550 in), Y: 3.18 mm (0.125 in), and Z: 3.10 mm (0.122 in). The device is RoHS compliant and provides thermal management through natural or forced air convection, with thermal performance varying based on air velocity. This heat sink is ideal for applications requiring compact board-level thermal solutions for power semiconductor packages in industrial, automotive, and consumer electronics.
Search Keywords: 7023BMTG
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is 7023B-MTG RoHS compliant?
Yes, 7023B-MTG is RoHS compliant.
What is the lead time for 7023B-MTG?
The standard lead time for 7023B-MTG is approximately 6 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 5,554
Can Ship immediately
Minimum Order Quantity: 5
Factory Lead-Time 6 Weeks
Price (USD)
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