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7021B-8223-CL03G by boyd laconia llc

7021B-8223-CL03G

Boyd Laconia LLC

The 7021B-8223-CL03G is a channel-style, board-level heat sink with a factory-applied alignment pad for TO-220 semiconductor packages. ...

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DESCRIPTION

The 7021B-8223-CL03G is a channel-style heat sink designed for cooling TO-220 packages, featuring factory-applied solderable alignment pads to simplify and accelerate assembly. Constructed from 1.27 mm thick aluminum with a black anodize finish, this heat sink utilizes folded back fins to maximize the cooling surface area and achieves a natural convection thermal resistance of 6.8 °C/W. The pre-applied alignment pads are an innovative feature that can significantly reduce assembly time, providing a cost-effective and reliable method for attaching the heat sink to the transistor and PCB. This makes it an ideal solution for board-level thermal management in various electronic applications.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
7021B-8223-CL03G
Alias/AKA:
052343
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8546900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1

IN STOCK: 235

Can Ship immediately

MOQ for In Stock Qty: 10

MOQ for out of Stock Qty: 10

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
10
$14.51
100
$8.91
250
$8.19
375
$8.07
750
$7.95
1,125
$7.82
1,500 +
$7.71

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